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news.Xpedx, an Ohio-based business of International Paper and a provider of packaging solutions for manufacturers in technology, food and beverage, automotive, pharmaceutical, health care and other industries, has established a new network of seven Package Design Centers by opening centers in the San Francisco Bay and Rochester areas of New York.
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It has also expanded its existing design centers in Chicago, Detroit, Kansas City, Pittsburgh and Juarez, Mexico metropolitan areas.
Additionally, xpedx has added new package design staff and services in 12 other US metropolitan regions to offer expertise on every aspect of packaging development, production, distribution and cost-management.
xpedx vice president of Packaging John Perrin said the company was committed to provide manufacturers with maximum visibility and control of packaging costs, reduction in supply chain complexity and best practices in package design.
xpedx Package Design Centers are located in California, Chicago, Rochester, Pittsburg, Michigan, Mexico and Kansas. Each one of them is staffed with packaging engineers, project managers, and employs full design, prototype development, and access to state-of-the-art testing capabilities.