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Mereco METADUCT 1202 Silver Adhesive meets packaging requirements

Mereco Technologies has announced that METADUCT 1202 Silver Adhesive is compliant with NASA's outgassing specification.

The silver-filled, electrically conductive epoxy is designed for lead attachment cold soldering, chip bonding, and lead frame bonding applications.

Supplied in plastic bubble packs from 2gm to 200 gm, five kits from 2 to 32 oz., and pre-mixed and frozen syringes, the silver adhesive cures at room temperature, the company said.

Solvent-free, non-bleeding, and thixotropic silver adhesive has a volume resistivity at 25°C of 10(^-4) Ohm-cm, 800 psi lap shear strength, and exhibits 80D Shore hardness.

The applications of the product include manufacturing, assembly, and repair of heat-sensitive components.